Micro Module Technology Corporation - Business Overview
Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!
We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities. **Benefits of Bare Chip Mounting** - **Increased Added Value** → Miniaturization and thinning expand product applications and create new markets. → Incorporating semiconductor backend processes enhances manufacturing added value. - **Improved Cost Competitiveness** → Miniaturization and standardization improve production efficiency and reduce material costs. → Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth. - **Enhanced Performance** → The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss. - **Environmental Considerations** → Reducing the number of materials used can decrease waste.
- Company：マイクロモジュールテクノロジー
- Price：Other
![[Hardware Development Achievements] 64ch FPIX Board](https://image.mono.ipros.com/public/product/image/96d/2000610317/IPROS15520091796991262499.png?w=280&h=280)
